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The MIT Lincoln Laboratory Microelectronics Laboratory is the U.S. government's most capable semiconductor research and fabrication facility. This 70,000-square-foot facility has 8,100 square feet of class-10 and 10,000 square feet of class-100 cleanroom areas to support a wide range of Lincoln Laboratory programs.

The 200-mm wafer equipment is continually updated and includes a production-class complementary metal oxide semiconductor (CMOS) toolset with angled ion-implantation, cluster metallization, and dry etch equipment; chemical-mechanical planarization equipment; and rapid thermal processing and advanced lithography capabilities. A molecular-beam epitaxy system is used to provide high-sensitivity and highly stable back-illuminated devices in the ultraviolet and extreme ultraviolet ranges.